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ON DEMAND WEBINAR: Challenges and Solution for Pick and Place Automation of Thermal Gap Filler Pads

ON DEMAND WEBINAR: Challenges and Solution for Pick and Place Automation of Thermal Gap Filler Pads
Electronics Cooling Magazine features Fujipoly America Corporation On-Demand at Thermal Live!
 
ON DEMAND WEBINAR: Challenges and Solution for Pick and Place Automation of Thermal Gap Filler Pads
 
Automation in electronics manufacturing is nothing new, but today many thermal gap filler pads are still placed by hand. With an increasing demand for automation the need to incorporate gap filler pad installation into automated processes is growing. In this webinar we will discuss what makes gap filler pads a challenge for pick and place manufacturing processes and how to address the specific handling challenges of gap filler pads. 
 
Presented by: Christian Miraglia
Applications Engineering Manager
Fujipoly America-Customer Engineering Resource Center (CERC)

Christian is a graduate of the New Jersey Institute of Technology and has over 15 years of experience working in Thermal interface. He has worked extensively with customers to find solutions to their thermal interface challenges.

Duration: 48 Minutes

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