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Hard Surface TIM

Thermal Putty

Fujipoly announces the addition of sarcon 100GR-HL to its line of specially formulated ThermalInterface Materials. This advance gap filler pad is manufactured with a hardened top surface. The uniqe, one-sided treatment is less tacky than the opposing surface allowing the thermal pad to consistently adhere to either the target electrical component or opposing heat sink. The hard surface allows for effortless removal without tearing or damaging the material during assembly and rework operations.

Sarcon® 100GR-HL transfers heat with a thermal conductivity of 2.8 W/m°K and a thermal resistance of .44°Cin2/W at 72.5 PSI. This 1.0mm thick, flame retardant TIM is available in sheets up to 300mm x 200mm.

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March 23, 2010

Oy Modilis Ltd. and Fuji Polymer Industries Co. Ltd. are proud to introduce the Highly Efficient Ultra-Thin FlexFilm™ Backlight Solution for Handheld, Notebook and Netbook Applications, including Keypads, Touchpads, Logos, Decorative covers, Icons and Active Indicator Illumination.

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